NMPG-450

A High-End Machine for a Wide Range of Substrates, from Smartphones and PCs to Automotive Applications and Ø300 mm Wafers

Equipped with three tool spindles: One spindle for outer-edge processing (Ø90 mm, 8,000 min^⁻¹) Two spindles for hole and recess machining (Ø5 mm, 50,000 min^⁻¹) High productivity for complex-shaped workpieces Supported workpiece sizes: Round: Ø50 to Ø320 mm Square: 50 to 320 mm Thickness: up to 10 mm^*¹ Two independently driven machining stages Capable of processing curved-surface substrates Optional 5-station ATC for small-diameter spindle^*² Extended grinding wheel life and simplified tool management *¹ Certain conditions apply. Please contact us for details. *² When equipped with the ATC option, the tool spindle speed is 50,000 min⁻¹.

High-Precision Positioning with Vision-Based Alignment

High-precision centering for workpieces of various shapes, reducing stock allowance while shortening machining time and extending grinding wheel life. One-chuck, multi-process machining with three different grinding wheels. Process integration simplifies production flow and process management. Improves edge strength to help prevent chipping and cracking.

SiC Wafer Machining Example

High-speed, high-precision machining of difficult-to-machine materials such as SiC wafers and quartz photomasks.

Quartz Photomask Machining Example